Bussone-Grifone, Genziana: Structure and electrical response of GaAs nanowires : looking for a correlation at the nano-scale. 2014
Inhalt
- Abstract (English/Deutsch)
- Contents
- Acronyms
- List of figures
- List of tables
- 1. Introduction
- 2. GaAs nanowires
- 2.1 Crystal structure of GaAs nanowires
- 2.2 MBE growth and details on VLS growth mechanism
- 2.3 Physics at the nano-scale
- 2.3.1 Characterization at the nano-scale
- 2.3.2 Electrical and optical properties: the band structure
- 2.3.3 Thermal properties
- 2.4 Applications
- 2.5 Selected techniques for structural characterizations
- 3. X-ray kinematic diffraction and synchrotron radiation
- 3.1 Reciprocal lattice and crystal planes
- 3.2 Basics of X-ray kinematic diffraction
- 3.3 A synchrotron beamline: ESRF-ID01
- 3.4 Diffraction geometries
- 4. Grazing incidence X-ray diffraction of single GaAs nanowires
- 4.1 Probing the in-plane strain in single GaAs nanowires
- 4.2 GaAs nanowires at locations defined by focused-ion beams
- 4.3 The details about the experimental configuration
- 4.4 Determination of the in-plane strain
- 4.5 Summary
- 5. Correlation of electrical and structural properties in single GaAs nanowires
- 5.1 Electrical measurement: the first attempts with an AFM
- 5.2 The electrical and structural characterization of the same nanowire: samples and methods
- 5.3 The electrical characterization: theory and models
- 5.3.1 Contacts to a single nanowire
- 5.3.2 Multiple regimes in a NW characteristic
- 5.3.3 Thermoionic emission theory and Schottky model
- 5.4 Back-to-back Schottky model: the data analysis (method A)
- 5.5 Space Charge Limited Current model: the data analysis (method B)
- 5.6 Total series resistance, effective mobility and charge carrier density
- 5.7 The structural characterization
- 5.8 The correlation
- 5.9 Discussion on the present results and summary
- 5.10 The last attempts with STM
- 6. Strain impact of BCB polymer curing on embedded semiconductor nanostructures
- 6.1 BCB, an organic polymer for the planarization of nanostructures
- 6.2 Samples and experimental method
- 6.3 Elastic strain inherent to the thermal history of the fabrication method
- 6.4 Thermal expansion coefficients and polymer curing: the FEM simulation
- 6.5 Application of an external static electric field
- 6.6 Summary
- 7. Conclusions
- Bibliography
- Acknowledgements